US Patent Application 18446906. ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract

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ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Youngsub Kim of Suwon-si (KR)]]

[[Category:Sanghoon Park of Suwon-si (KR)]]

[[Category:Jungho Park of Suwon-si (KR)]]

[[Category:Kwanghyun Baek of Suwon-si (KR)]]

[[Category:Youngju Lee of Suwon-si (KR)]]

[[Category:Jungyub Lee of Suwon-si (KR)]]

[[Category:Juneseok Lee of Suwon-si (KR)]]

[[Category:Dohyuk Ha of Suwon-si (KR)]]

[[Category:Jinsu Heo of Suwon-si (KR)]]

ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446906 titled 'ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

Simplified Explanation

The abstract describes a communication system that supports a higher data transmission rate than 4G systems.

  • The system is specifically designed for 5G or pre-5G communication.
  • It includes an antenna structure with a first radiator and a first printed circuit board (PCB).
  • There are also multiple second radiators and a second PCB.
  • A frame structure is arranged to create an air layer between the first and second PCBs.
  • The second radiators can include a first metal patch corresponding to the first radiator.
  • There are also multiple second metal patches that are separated from the first metal patch and fed by coupling.


Original Abstract Submitted

The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.

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