US Patent Application 18446858. WAFER DRYING SYSTEM simplified abstract

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WAFER DRYING SYSTEM

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Wei-Chun Hsu of Hsinchu (TW)

Sheng-Wei Wu of Zhubei (TW)

Shu-Yen Wang of Taipei (TW)

WAFER DRYING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446858 titled 'WAFER DRYING SYSTEM

Simplified Explanation

The patent application is for a system and method for drying wafers and detecting airborne molecular contaminants in the drying gas as a feedback parameter.

  • The system includes a wafer drying station that dispenses drying gas over one or more wafers to dry them.
  • The system also includes a valve that diverts the drying gas into two portions.
  • The first portion of the drying gas is exhausted through an exhaust line.
  • The second portion of the drying gas is received by a detector, which determines a real-time property of the gas.
  • A control unit then uses this real-time property to control the feedback operation of the wafer drying station.
  • The purpose of this system is to ensure that the drying gas is free from contaminants that could potentially damage the wafers during the drying process.


Original Abstract Submitted

The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.