US Patent Application 18446837. INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME simplified abstract

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INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Doyoung Yoon of SUWON-SI (KR)]]

[[Category:Jeongho Ahn of SUWON-SI (KR)]]

[[Category:Dongryul Lee of SUWON-SI (KR)]]

[[Category:Dongchul Ihm of SUWON-SI (KR)]]

[[Category:Chungsam Jun of SUWON-SI (KR)]]

INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446837 titled 'INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME

Simplified Explanation

The patent application describes a system for inspecting semiconductor wafers.

  • The system includes a wafer chuck inside a chamber, where the wafer is placed.
  • A light source is used to emit light onto the wafer to inspect its pattern.
  • An inspection controller is responsible for controlling the light source.
  • A cooling gas gun is positioned next to the light source and sprays a cooling gas onto the wafer's surface.
  • A cooling controller supplies cooling air to the wafer chuck before the light is emitted and provides the cooling gas to the cooling gas gun.

Bullet points explaining the patent/innovation:

  • The system allows for efficient inspection of semiconductor wafers.
  • The wafer chuck securely holds the wafer in place during the inspection process.
  • The light source illuminates the wafer, enabling the inspection of its pattern.
  • The inspection controller ensures precise control over the light source.
  • The cooling gas gun helps maintain the temperature of the wafer during inspection.
  • The cooling controller ensures proper cooling of the wafer before and during the inspection.


Original Abstract Submitted

A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.