US Patent Application 18366758. STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES simplified abstract
Contents
STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Kuo-Chiang Ting of Hsinchu (TW)
STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18366758 titled 'STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES
Simplified Explanation
- The patent application describes semiconductor devices and methods for their formation. - A method is described where a first material layer is placed between a second material layer and a semiconductor substrate. - A first waveguide is formed in the second material layer. - A photonic die is formed over the first waveguide. - A first cavity is formed in the semiconductor substrate, exposing the first layer. - The first cavity is filled with a first backfill material adjacent to the first layer. - An electronic die is electrically coupled to the photonic die. - Some methods include packaging the semiconductor device in a packaged assembly.
Original Abstract Submitted
Semiconductor devices and methods of forming the semiconductor devices are described herein. A method includes providing a first material layer between a second material layer and a semiconductor substrate and forming a first waveguide in the second material layer. The method also includes forming a photonic die over the first waveguide and forming a first cavity in the semiconductor substrate and exposing the first layer. Once formed, the first cavity is filled with a first backfill material adjacent the first layer. The methods also include electrically coupling an electronic die to the photonic die. Some methods include packaging the semiconductor device in a packaged assembly.
