US Patent Application 18359871. METHOD AND SYSTEM FOR SCANNING WAFER simplified abstract
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Contents
METHOD AND SYSTEM FOR SCANNING WAFER
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Inventor(s)
PEI-HSUAN Lee of TAIPEI CITY (TW)
CHIEN-HSIANG Huang of HSINCHU (TW)
KUANG-SHING Chen of HSINCHU (TW)
KUAN-HSIN Chen of HSINCHU (TW)
CHUN-CHIEH Chin of HSINCHU (TW)
METHOD AND SYSTEM FOR SCANNING WAFER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359871 titled 'METHOD AND SYSTEM FOR SCANNING WAFER
Simplified Explanation
The patent application describes a method and system for scanning wafers.
- The system captures an image of a defect on a wafer.
- It generates a reference image using a reference image generation model.
- The system then creates a defect marked image by combining the defect image and the reference image.
Original Abstract Submitted
The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.
