US Patent Application 18357054. HEATSINK WITH ADJUSTABLE FIN PITCH simplified abstract

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HEATSINK WITH ADJUSTABLE FIN PITCH

Organization Name

NVIDIA Corporation

Inventor(s)

Susheela Narasimhan of Fremont CA (US)

Michal L. Sabotta of Cypress TX (US)

HEATSINK WITH ADJUSTABLE FIN PITCH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18357054 titled 'HEATSINK WITH ADJUSTABLE FIN PITCH

Simplified Explanation

The abstract describes an apparatus that includes a heat pipe, cooling fins, and a movable support for cooling an integrated circuit.

  • The apparatus includes a heat pipe that is connected to an integrated circuit and has an evaporator and a condenser.
  • The condenser extends away from the evaporator and is attached to a first set of cooling fins.
  • A movable support is thermally connected to the condenser and can move a second set of cooling fins.
  • The second set of cooling fins is attached to the movable support.


Original Abstract Submitted

An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

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