US Patent Application 18351831. CURABLE RESIN COMPOSITION simplified abstract
Contents
CURABLE RESIN COMPOSITION
Organization Name
Inventor(s)
Kyohei Wada of Kawasaki-shi (JP)
Ryo Ogawa of Kawasaki-shi (JP)
CURABLE RESIN COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18351831 titled 'CURABLE RESIN COMPOSITION
Simplified Explanation
The patent application describes a curable resin composition that can be used in various applications.
- The composition includes a specific curable resin and a curing agent.
- It also includes a polyhydric alcohol with 2 to 5 hydroxyl groups, in a specific amount.
- Additionally, it can include a cyclic compound with 3 to 6 reactive groups, or a specific oxetane compound, in a specific ratio to the curable resin.
- The composition aims to provide improved curability and mechanical properties.
Original Abstract Submitted
A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.
