US Patent Application 18339102. High Density 3D Interconnect Configuration simplified abstract
Contents
High Density 3D Interconnect Configuration
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA (US)
Zhitao Cao of Campbell CA (US)
Kunzhong Hu of Cupertino CA (US)
High Density 3D Interconnect Configuration - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18339102 Titled 'High Density 3D Interconnect Configuration'
Simplified Explanation
The abstract describes the integration of a 3D interconnect structure into electronic package structures and systems. This integration is done in the package redistribution layer and/or chiplet to enable efficient power and signal delivery to a die. By incorporating this structure, the input output density and routing quality of signals can be greatly improved, while still maintaining feasible power delivery.
Original Abstract Submitted
Electronic package structures and systems are described in which a 3D interconnect structure is integrated into a package redistribution layer and/or chiplet for power and signal delivery to a die. Such structures may significantly improve input output (TO) density and routing quality for signals, while keeping power delivery feasible.
