US Patent Application 18323820. SUBSTRATE PROCESSING APPARATUS simplified abstract
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Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Mitsuyoshi Makida of Tokyo (JP)
Masashi Matsumoto of Tokyo (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18323820 titled 'SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The patent application describes a substrate processing apparatus that includes a lower jig plate, columnar members, and a heat dissipating column.
- The lower jig plate is used to arrange a substrate that needs to be pressurized.
- The columnar members support the lower jig plate.
- The heat dissipating column comes into direct or indirect contact with the lower jig plate.
- The heat dissipating column has a higher heat dissipation property compared to the columnar members.
- The purpose of the heat dissipating column is to efficiently dissipate heat generated during substrate processing.
- This innovation aims to improve the overall performance and efficiency of the substrate processing apparatus.
Original Abstract Submitted
A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.