US Patent Application 18323745. SUBSTRATE PROCESSING APPARATUS simplified abstract

SUBSTRATE PROCESSING APPARATUS

Organization Name

TDK CORPORATION

Inventor(s)

Yohei Sato of Tokyo (JP)

Hiroshi Koizumi of Tokyo (JP)

Toshinobu Miyagoshi of Tokyo (JP)

Osamu Shindo of Tokyo (JP)

Seijiro Sunaga of Tokyo (JP)

Mitsuyoshi Makida of Tokyo (JP)

Makoto Yamashita of Tokyo (JP)

Yasuo Kato of Tokyo (JP)

Ryo Shindo of Tokyo (JP)

Masashi Matsumoto of Tokyo (JP)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18323745 titled 'SUBSTRATE PROCESSING APPARATUS

Simplified Explanation

The patent application describes a substrate processing apparatus that applies pressure to a substrate.

• The apparatus includes an upper jig plate and a lower jig plate.
• The substrate, which is the object to be pressurized, is arranged on the upper jig plate.
• The lower jig plate is positioned below the upper jig plate.
• An installation base is provided on the lower jig plate, where the substrate is arranged.
• The installation base is temporarily fixed to the lower jig plate in a deformable manner.

Original Abstract Submitted

A substrate processing apparatus applies pressure to a substrate which is an object to be pressurized arranged on an upper jig plate . The substrate processing apparatus includes a lower jig plate arranged below the upper jig plate , an installation base provided on the lower jig plate and the substrate is arranged; and the installation base is temporarily fixed to the installation base in a deformable manner.