US Patent Application 18323467. SUBSTRATE PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Makoto Yamashita of Tokyo (JP)
Mitsuyoshi Makida of Tokyo (JP)
Masashi Matsumoto of Tokyo (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18323467 titled 'SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The patent application describes a substrate processing apparatus that can apply a uniform load to an object to be pressurized.
- The apparatus includes a lower jig plate for arranging the substrate, which is the object to be pressurized.
- An upper jig plate is used to apply pressure to the substrate arranged on the lower jig plate.
- A support member is included to support the lower jig plate and provide a support force according to the in-plane distribution of the load applied to the lower jig plate.
Original Abstract Submitted
Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate for arranging a substrate which is an object to be pressurized, an upper jig plate applying pressure to the substrate arranged to the lower jig plate , and a support member supporting the lower jig plate and providing a support force to the lower jig plate in accordance with a in-plane distribution of a load applied to the lower jig plate
