US Patent Application 18322284. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT simplified abstract

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Hiromitsu Ito of Nagaokakyo-shi (JP)

Yuichi Iida of Nagaokakyo-shi (JP)

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18322284 titled 'ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Simplified Explanation

The patent application describes an electronic component that includes a glass substrate, an outer surface conductor, and a protective film. The glass substrate has different surface roughness values at the interfaces with the outer surface conductor and the protective film. The outer surface conductor also has a specific surface roughness at its interface with the protective film.

• Glass substrate with different surface roughness at interfaces
• Outer surface conductor in contact with the glass substrate
• Protective film covering the glass substrate and outer surface conductor
• Glass substrate has first surface roughness at interface with outer surface conductor
• Glass substrate has second surface roughness at interface with protective film
• Outer surface conductor has third surface roughness at interface with protective film
• Ra<Ra<Ra relationship is satisfied

Original Abstract Submitted

An electronic component includes a glass substrate, an outer surface conductor that is in contact with an outer surface of the glass substrate, and a protective film that covers the outer surface of the glass substrate and the outer surface conductor and is in contact with the outer surface of the glass substrate and the outer surface conductor. When the glass substrate has first surface roughness Ra at an interface between the glass substrate and the outer surface conductor, the glass substrate has second surface roughness Ra at an interface between the glass substrate and the protective film, and the outer surface conductor has third surface roughness Ra at an interface between the outer surface conductor and the protective film, Ra<Ra<Ra is satisfied.