US Patent Application 18307554. Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module simplified abstract

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Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module

Organization Name

Apple Inc.


Inventor(s)

Vidhya Ramachandran of Cupertino CA (US)


Jun Zhai of San Jose CA (US)


Chonghua Zhong of Cupertino CA (US)


Kunzhong Hu of Cupertino CA (US)


Shawn Searles of Austin TX (US)


Joseph T. Dibene, Ii of Corralitos CA (US)


Mengzhi Pang of Cupertino CA (US)


Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18307554 Titled 'Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module'

Simplified Explanation

The abstract describes systems that consist of integrated circuit dies and voltage regulator units. These systems have a voltage regulator module and an integrated circuit mounted together in a single package. The voltage regulator module contains a voltage regulator circuit and passive devices mounted on a common substrate. The integrated circuit is a System-on-a-chip. The system package has an interconnect region with wires fabricated on multiple conductive layers. One of the power supply terminals of the integrated circuit is connected to the output of the voltage regulator module through a wire in the interconnect region.


Original Abstract Submitted

Systems that include integrated circuit dies and voltage regulator units are disclosed. Such systems may include a voltage regulator module and an integrated circuit mounted in a common system package. The voltage regulator module may include a voltage regulator circuit and one or more passive devices mounted to a common substrate, and the integrated circuit may include a System-on-a-chip. The system package may include an interconnect region that includes wires fabricated on multiple conductive layers within the interconnect region. At least one power supply terminal of the integrated circuit may be coupled to an output of the voltage regulator module via a wire included in the interconnect region.