US Patent Application 18249630. WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD simplified abstract
Contents
WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD
Organization Name
Inventor(s)
Akiko Kiyotomi of Koshi City, Kumamoto (JP)
WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18249630 titled 'WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD
Simplified Explanation
The patent application describes an apparatus for estimating the warpage amount of a substrate.
- The apparatus includes an acquirer that captures an image of one surface of the substrate.
- A calculator is used to calculate the rate of change in pixel value in the captured image along the radial direction of the substrate.
- An estimator then uses a pre-determined correlation between the rate of change in pixel value and the warpage amount of the substrate to estimate the warpage amount.
- The estimation is based on the calculation result obtained by the calculator.
Original Abstract Submitted
A warpage amount estimation apparatus for estimating a warpage amount of a substrate, includes: an acquirer configured to acquire a captured image of one surface of an estimation target substrate; a calculator configured to calculate a rate of change in pixel value relating to a substrate radial direction in the captured image of the one surface of the estimation target substrate; and an estimator configured to estimate a warpage amount of the estimation target substrate based on a correlation obtained in advance between a rate of change in pixel value relating to the substrate radial direction in a captured image of the one surface of a substrate and a warpage amount of the substrate, and on a calculation result by the calculator.
