US Patent Application 18245404. Semiconductor Integrated Circuit simplified abstract

Semiconductor Integrated Circuit

Organization Name

Nippon Telegraph and Telephone Corporation

Inventor(s)

Miwa Muto of Musashino-shi, Tokyo (JP)

Hideaki Matsuzaki of Musashino-shi, Tokyo (JP)

Semiconductor Integrated Circuit - A simplified explanation of the abstract

This abstract first appeared for US patent application 18245404 titled 'Semiconductor Integrated Circuit

Simplified Explanation

The patent application describes a method of applying a second protective film on top of a first protective film.

• The second protective film is formed to cover the first protective film.
• The end portion of the second protective film is positioned between a wiring line and a bonding pad at the edge of the bonding pad.
• The purpose of the second protective film is to provide additional protection to the first protective film and the components underneath.
• This method helps to prevent damage or contamination to the wiring line and bonding pad.
• The invention improves the overall durability and reliability of the protected components.

Original Abstract Submitted

A second protective film is formed on and in contact with a first protective film, and is formed to cover the first protective film. The second protective film is also formed so that an end portion extending toward the center of a first opening is interposed between a wiring line and a bonding pad at the edge portion of the bonding pad.