US Patent Application 18211086. INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES simplified abstract
Contents
INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES
Organization Name
Inventor(s)
David Pakula of San Francisco CA (US)
Stephen Brian Lynch of Portola Valley CA (US)
Richard Hung Minh Dinh of Cupertino CA (US)
Tang Yew Tan of Palo Alto CA (US)
INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18211086 Titled 'INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES'
Simplified Explanation
The abstract describes an electronic device that has a glass cover and a surrounding structure made of glass as well. The glass structure is attached to the glass cover using an adhesive or by molding it directly onto the cover. This creates a seamless and gapless connection between the two. The surrounding structure consists of an inner and outer part.
Original Abstract Submitted
An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
