US Patent Application 18198389. DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract

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DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Organization Name

Samsung Display Co., LTD.==Inventor(s)==

[[Category:Joonyung Jang of Yongin-si, Gyeonggi-do (KR)]]

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18198389 titled 'DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The patent application describes a display apparatus that includes a display panel and an electronic chip package.

  • The display panel has two pads, while the electronic chip package has two bumps that overlap the pads.
  • Between each pad and bump, there is a conductive adhesive layer that includes a resin and a conductive ball.
  • The first conductive adhesive layer is between the first pad and the first bump, while the second conductive adhesive layer is between the second pad and the second bump.
  • The second resin in the second conductive adhesive layer is made of the same material as the first resin in the first conductive adhesive layer.
  • Similarly, the second conductive ball in the second conductive adhesive layer is made of the same material as the first conductive ball in the first conductive adhesive layer.
  • An elastic layer, made of an elastomer, is placed between the first bump and the second bump.


Original Abstract Submitted

A display apparatus includes: a display panel including a first pad and a second pad; an electronic chip package including a first bump arranged to overlap the first pad and a second bump arranged to overlap the second pad; a first conductive adhesive layer arranged between the first pad and the first bump and including a first resin and a first conductive ball; a second conductive adhesive layer arranged between the second pad and the second bump and including a second resin including the same material as the first resin and a second conductive ball including the same material as the first conductive ball; and an elastic layer arranged between the first bump and the second bump and including an elastomer.

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