US Patent Application 18196678. MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF simplified abstract

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MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF

Organization Name

HUAWEI TECHNOLOGIES CO., LTD.


Inventor(s)

Thomas Knieling of Munich (DE)

Ulrich Hofmann of Itzehoe (DE)

Stephan Marauska of Itzehoe (DE)

Berkan Zorlubas of Itzehoe (DE)

Fabian Schwarz of Itzehoe (DE)

Frank Senger of Itzehoe (DE)

Yong Cao of Munich (DE)

MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18196678 titled 'MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF

Simplified Explanation

The patent application describes a micromechanical resonator wafer assembly that includes an actuator wafer and a device wafer.

  • The actuator wafer has an outer actuator layer with an oscillating part that can be driven by an electrical signal.
  • The device wafer is mounted on top of the actuator wafer and has multiple inner actuators.
  • Each inner actuator has an oscillation body that can oscillate in one or more directions.
  • The device wafer is physically connected to the actuator wafer, forming a coupled oscillation system with the outer actuator layer.
  • This allows for external actuation of the oscillation body of each inner actuator using the outer actuator layer.
  • The assembly provides improved scan angles and fast start-up time.


Original Abstract Submitted

A micromechanical resonator wafer assembly includes an actuator wafer supporting an outer actuator layer. The outer actuator layer includes an oscillating part configured to be driven by an electrical drive signal. The micromechanical resonator wafer assembly further includes a device wafer mounted on top of the actuator wafer. The device wafer includes a plurality of inner actuators. Each of the inner actuators include an oscillation body configured to oscillate about one or more axes. The device wafer is physically connected to the actuator wafer such that each of the inner actuators forms with the outer actuator layer a coupled oscillation system for excitation of the oscillation body of the respective inner actuator. The micromechanical resonator wafer assembly provides external actuation of the oscillation body of each of the inner actuators by use of the outer actuator layer and hence, provides improved scan angles with fast start-up time.

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