US Patent Application 18186876. LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME simplified abstract
Contents
LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
Jong Hyup Kim of Yongin-si (KR)
Jin Pyung Lee of Yongin-si (KR)
Yong Hwan Kim of Yongin-si (KR)
Hae Wook Yang of Yongin-si (KR)
LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18186876 titled 'LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING THE SAME
Simplified Explanation
The abstract describes a laser pressure head module that includes a pressure member and a gas supply unit.
- The pressure member consists of a first and second light-transmitting member with a sealed space between them.
- The gas supply unit is responsible for supplying gas to the sealed space, creating a pressing force.
- The pressing force causes the second light-transmitting member to expand or move in an external direction.
Original Abstract Submitted
A laser pressure head module including: a pressure member including: a first light-transmitting member; a second light-transmitting member; and a sealed space between the first light-transmitting member and the second light-transmitting member; and a gas supply unit to supply gas to the sealed space to generate a pressing force. The second light-transmitting member is to be expanded or moved in an external direction by the pressing force.
