US Patent Application 18150557. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE simplified abstract

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PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Jiun Yi Wu of Zhongli City (TW)

Chen-Hua Yu of Hsinchu (TW)

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18150557 titled 'PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE

Simplified Explanation

The patent application describes a method of forming a semiconductor package that combines electronic and photonic dies. Here are the key points:

  • The method involves bonding a first wafer (containing electronic dies) to a second wafer (containing photonic dies).
  • Trenches are then formed in the second wafer between adjacent photonic dies.
  • These trenches are filled with an optical glue.
  • The first and second wafers are then diced to form multiple photonic packages.
  • Each photonic package consists of an electronic die, a photonic die bonded to it, and the optical glue.
  • The optical glue extends along the sidewall of the photonic package.


Original Abstract Submitted

A method of forming a semiconductor package includes: bonding a first wafer to a second wafer, where the first wafer includes a plurality of electronic dies, and the second wafer includes a plurality of photonic dies; after bonding the first wafer, forming trenches in the second wafer between adjacent ones of the plurality of photonic dies; filling the trenches with an optical glue; and dicing the first wafer and the second wafer to form a plurality of photonic packages, where a photonic package of the plurality of photonic packages includes an electronic die, a photonic die bonded to the electronic die, and the optical glue, where the optical glue extends along a sidewall of the photonic package.

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