US Patent Application 18140447. LED LAMP FOR A VEHICLE AND A METHOD OF MANUFACTURING THE SAME USING MID AND MAGNETIC INDUCTION TECHNOLOGIES simplified abstract

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LED LAMP FOR A VEHICLE AND A METHOD OF MANUFACTURING THE SAME USING MID AND MAGNETIC INDUCTION TECHNOLOGIES

Organization Name

Hyundai Motor Company


Inventor(s)

Jun Sik Kim of Gwacheon-si (KR)

Jung Sik Choi of Siheung-si (KR)

Young Do Kim of Ansan-si (KR)

Tae Kyoung Jung of Bucheon-si (KR)

Seung-Sik Han of Hwaseong-si (KR)

Hong-Sik Chang of Hwaseong-si (KR)

Kwang-Pyo Cho of Gwangmyeong-si (KR)

Young-Ju Lee of Suwon-si (KR)

Jong-Hyun Park of Uiwang-si (KR)

Jin-Won Lee of Suwon-si (KR)

Jun-Geun Oh of Hwaseong-si (KR)

Cheon-Ho Kim of Hwaseong-si (KR)

Young-Jai Im of Hwaseong-si (KR)

Sun-Mi Oh of Bucheon-si (KR)

Kang-Sun Lee of Seongnam-si (KR)

Sae-Ah Kim of Hwaseong-si (KR)

Jong-Eun Park of Yongin-si (KR)

Kwan-Woo Lee of Yongin-si (KR)

Jong-Chae Lee of Asan-si (KR)

Jun-Hyun Park of Asan-si (KR)

Won-Il Lee of Gwangju (KR)

Dae-Woo Park of Gwangju (KR)

LED LAMP FOR A VEHICLE AND A METHOD OF MANUFACTURING THE SAME USING MID AND MAGNETIC INDUCTION TECHNOLOGIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18140447 titled 'LED LAMP FOR A VEHICLE AND A METHOD OF MANUFACTURING THE SAME USING MID AND MAGNETIC INDUCTION TECHNOLOGIES

Simplified Explanation

The abstract describes a patent application for a LED lamp for vehicles and a method of manufacturing it using MID and magnetic induction technologies.

  • The LED lamp includes a LED module, a housing, and a molded interconnect device (MID) electrode.
  • The LED module is mounted on the MID electrode using soldering with magnetic induction heating.
  • The housing is an injection molded product.
  • The MID electrode is formed on the housing using a MID process.


Original Abstract Submitted

A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.