US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
Contents
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18117869 Titled 'MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE'
Simplified Explanation
The abstract describes a molding apparatus that is used to create molded products. The apparatus consists of an upper mold and a lower mold, which are clamped together to create a space for molding. The lower mold has a seating surface where the substrate is placed. The lower mold also has suction grooves and vacuum holes. A release film is supplied onto the seating surface of the lower mold, and it is adhered using suction from the vacuum holes. The substrate is then placed on the release film and adhered using suction from the vacuum holes through the through holes of the release film.
Original Abstract Submitted
A molding apparatus includes a lower mold having a seating surface on which at least one substrate is seated; an upper mold clamped with the lower mold to form a molding space; at least one substrate suction groove extending in the seating surface; a plurality of first vacuum holes extending through the lower mold to be in communication with the substrate suction groove; a plurality of second vacuum holes extending through the lower mold to be opened through the seating surface; and a release film supply mechanism configured to supply a release film having a plurality of through holes, on the seating surface of the lower mold. The release film is adhered on the seating surface by suctioning air from the second vacuum holes, and the substrate is adhered on the release film by suctioning air from the first vacuum holes through the through holes of the release film.
