US Patent Application 18110013. COIL COMPONENT simplified abstract
Contents
COIL COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Boum Seock Kim of Suwon-si (KR)
Byeong Cheol Moon of Suwon-si (KR)
COIL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18110013 titled 'COIL COMPONENT
Simplified Explanation
The patent application describes a coil component with a body, coil portion, and insulating film.
- The coil component has a body with opposing surfaces and a coil portion with first and second coils.
- The first and second coils are connected to each other through a via.
- An insulating film covers the coil portion and extends between the first and second coils.
- The insulating film is in contact with at least one surface of the first and second coils and a side surface of the via.
- The body also has first and second external electrodes connected to the coil portion.
Original Abstract Submitted
A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a coil portion disposed in the body and including first and second coils, and a via connecting the first and second coils to each other, an insulating film covering the coil portion and extending to a region between the first and second coils, and first and second external electrodes disposed on the body and connected to the coil portion. The insulating film is in contact with at least one of opposing surfaces of the first and second coils which face each other and is in contact with a side surface of the via.
