US Patent Application 18032797. INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE simplified abstract

INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE

Organization Name

Hewlett-Packard Development Company, L.P.

Inventor(s)

Eric T. Martin of Corvallis OR (US)

James R. Przybyla of Corvallis OR (US)

Garrett E. Clark of Corvallis OR (US)

INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18032797 titled 'INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE

Simplified Explanation

The abstract describes a fluidic die that dispenses fluid using fluidic elements, each consisting of a fluidic actuator and a fluid chamber. The die includes an array of fluid feed holes in different dimensions to supply fluid to the elements. Circuit elements with active devices are interspersed between the fluidic elements on the same substrate.

• The patent application is for a fluidic die that dispenses fluid using fluidic elements.
• Each fluidic element consists of a fluidic actuator and a fluid chamber.
• The die includes an array of fluid feed holes in different dimensions to supply fluid to the elements.
• Multiple fluid feed holes along one dimension are distinct from multiple feed holes along another dimension.
• Circuit elements with active devices are interspersed between the fluidic elements on the same substrate.
• The fluidic die and circuit elements are formed on a common substrate.

Original Abstract Submitted

In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.