US Patent Application 18032168. DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL simplified abstract
Contents
DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
Hirotsugu Iwasaki of Hyogo (JP)
Michiko Matsukawa of Hyogo (JP)
DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18032168 titled 'DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL
Simplified Explanation
The abstract describes a diamond sintered material that consists of diamond grains. The content ratio of the diamond grains in the material is between 80% and 99% by volume. The average grain size of the diamond grains ranges from 0.1 μm to 50 μm. The dislocation density of the diamond grains falls between 8.1×10^6 and 1.0×10^7.
- Diamond sintered material with high diamond grain content (80-99% by volume)
- Diamond grains have an average size of 0.1 μm to 50 μm
- Diamond grains have a specific dislocation density range (8.1×10^6 to 1.0×10^7)
Original Abstract Submitted
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10mand less than 1.0×10m.
