US Patent Application 17977018. GRINDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
GRINDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Jaeyoung Hong of Suwon-si (KR)
GRINDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17977018 Titled 'GRINDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME'
Simplified Explanation
The abstract describes a grinding apparatus and a method for manufacturing a semiconductor device using the apparatus. The grinding apparatus consists of a chuck unit that holds the substrate, a grinding unit that grinds the substrate, and a dressing unit located beneath the grinding unit. The dressing unit includes a dressing board that is used to maintain the condition of the grinding unit, and magnets are placed under the dressing board.
Original Abstract Submitted
A grinding apparatus and a method for manufacturing a semiconductor device using the same are provided. A griding apparatus includes a chuck unit configured to receive a substrate, a grinding unit on a part of the chuck unit and configured to grind the substrate, and a dressing unit under a part of the grinding unit adjacent to the chuck unit and including a dressing board configured to dress the grinding unit and magnets under the dressing board.
