US Patent Application 17828310. Integrated Circuit Packages and Methods of Forming the Same simplified abstract

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Integrated Circuit Packages and Methods of Forming the Same

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Pei-Haw Tsao of Tai-chung (TW)

Chien-Li Kuo of Hsinchu (TW)

Kuo-Chio Liu of Hsinchu (TW)

Integrated Circuit Packages and Methods of Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 17828310 titled 'Integrated Circuit Packages and Methods of Forming the Same

Simplified Explanation

The abstract describes a method for forming an integrated circuit package. Here are the key points:

  • The method involves attaching a first carrier to a package component.
  • The package component includes an interposer, a first semiconductor die, a second semiconductor die, an encapsulant, and conductive connectors.
  • A second carrier is attached to a package substrate, which has bond pads.
  • The conductive connectors of the package component are bonded to the bond pads of the package substrate by reflowing the conductive connectors.
  • This bonding process occurs while the first carrier is attached to the package component and the second carrier is attached to the package substrate.
  • After bonding, the first carrier and the second carrier are removed.


Original Abstract Submitted

In an embodiment, a method of forming an integrated circuit package includes: attaching a first carrier to a package component, the package component comprising: an interposer; a first semiconductor die attached to a first side of the interposer; a second semiconductor die attached to the first side of the interposer; an encapsulant encapsulating the first semiconductor die and the second semiconductor die; and conductive connectors attached to a second side of the interposer; attaching a second carrier to a package substrate, the package substrate comprising bond pads; bonding the conductive connectors of the package component to the bond pads of the package substrate by reflowing the conductive connectors while the first carrier is attached to the package component and while the second carrier is attached to the package substrate; removing the first carrier; and removing the second carrier.

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