US Patent Application 17828066. SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME simplified abstract
SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Li-Ling Liao of Hsinchu City (TW)
Ming-Chih Yew of Hsinchu City (TW)
Chia-Kuei Hsu of y Hsinchu City (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
Meng-Liang Lin of Hsinchu (TW)
SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17828066 titled 'SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME
Simplified Explanation
- The patent application is about semiconductor packages and methods of fabricating them. - The packages include bonding structures on an interposer, which is a component that connects the semiconductor device to the package substrate. - The interposer has non-uniform height dimensions in different regions, meaning that it is not flat or even throughout. - The non-uniform heights of the interposer compensate for any warping or bending that may occur, improving the reliability of the electrical connections between the interposer and the package substrate. - The electrical connections are made through solder connections that contact pillars on the interposer and connect them to corresponding bonding structures on the package substrate.
Original Abstract Submitted
Semiconductor packages and methods of fabricating semiconductor packages include bonding structures on a surface of an interposer having non-uniform height dimensions in different regions of the interposer. A plurality of solder connections may contact the pillars and electrically connect the respective pillars of the interposer to corresponding bonding structures on a package substrate. The variation in the heights of the pillars in different regions of the interposer may compensate for warping of the interposer and improve the reliability of the electrical connections between the interposer and the package substrate.
