US Patent Application 17828064. PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME simplified abstract

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PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Meng-Liang Lin of Hsinchu (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17828064 titled 'PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME

Simplified Explanation

The patent application describes a semiconductor structure with a packaging substrate that has a trench between two regions.

  • The semiconductor structure includes a packaging substrate with at least one trench located between a first region and a second region.
  • A first chip module is bonded to the first region of the packaging substrate using first solder material portions.
  • A second chip module is bonded to the second region of the packaging substrate using second solder material portions.
  • A first underfill material portion surrounds the first solder material portions and extends into a first portion of the trench.
  • A second underfill material portion surrounds the second solder material portions and extends into a second portion of the trench.
  • The trench is used to absorb stress to the underfill material portions.


Original Abstract Submitted

A semiconductor structure includes a packaging substrate containing at least one trench located between a first region and a second region, a first chip module bonded to the first region of the packaging substrate through first solder material portions, and a second chip module bonded to the second region of the packaging substrate through second solder material portions. A first underfill material portion laterally surrounds the first solder material portions and extends into a first portion of the at least one trench. A second underfill material portion laterally surrounds the second solder material portions and extends into a second portion of the at least one trench. The at least one trench is used to absorb stress to the underfill material portions.

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