US Patent Application 17824930. APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract

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APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor(s)

CHUN-HSI Huang of HSINCHU CITY (TW)

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17824930 titled 'APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Simplified Explanation

The patent application describes an apparatus and method for forming a semiconductor structure.

  • The apparatus includes a polishing pad, a polishing head, and a temperature control module.
  • The polishing head holds a substrate against the polishing pad.
  • The temperature control module is positioned facing the polishing pad.
  • The temperature control module consists of a first temperature controller and a second temperature controller.
  • The first temperature controller regulates the temperature of a first zone on the polishing pad.
  • The second temperature controller regulates the temperature of a second zone on the polishing pad.


Original Abstract Submitted

An apparatus and a method for forming a semiconductor structure are provided. The apparatus includes a polishing pad, a polishing head and a temperature control module. The polishing head mounts a substrate against the polishing pad. The temperature control module faces the polishing pad. The temperature control module includes a first temperature controller and a second temperature controller. The first temperature controller is configured to control a first temperature of a first zone of the polishing pad. The second temperature controller is configured to control a second temperature of a second zone of the polishing pad.

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