US Patent Application 17824923. METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF simplified abstract

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METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor(s)

WEI-KANG Liu of TAICHUNG CITY (TW)

CHIH-TSUNG Shih of HSINCHU CITY (TW)

HAU-YAN Lu of HSINCHU CITY (TW)

YINGKIT FELIX Tsui of CUPERTINO CA (US)

METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17824923 titled 'METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF

Simplified Explanation

The patent application describes a method for manufacturing an integrated circuit device.

  • The method involves using a photonic structure that includes an insulating structure and an optical coupler embedded within it.
  • A portion of the insulating structure is removed to expose a coupling surface of the optical coupler.
  • This removal forms a light reflective structure that corresponds to the exposed coupling surface.
  • The innovation allows for the creation of an integrated circuit device with improved optical coupling capabilities.


Original Abstract Submitted

A method for manufacturing an integrated circuit device is provided. The method includes: providing a photonic structure including an insulating structure and an optical coupler embedded in the insulating structure; and removing a portion of the insulating structure to expose a coupling surface of the optical coupler and form a light reflective structure corresponding to the coupling surface.

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