US Patent Application 17746955. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Hung-Yi Kuo of Taipei City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Kuo-Chung Yee of Taoyuan City (TW)

Chen-Hua Yu of Hsinchu City (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17746955 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The patent application describes a semiconductor package and a method for manufacturing it.

• The semiconductor package includes a first semiconductor die with transistors formed on a substrate.
• A power distribution network is present on the back side of the substrate, providing power and ground signals to the transistors.
• A dielectric material surrounds the first semiconductor die.
• A second semiconductor die is bonded to the first semiconductor die, with its central portion, and its peripheral portion is in contact with the dielectric material.

Original Abstract Submitted

A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and transistors formed at a front side of the substrate; a power distribution network, spreading at a back side of the substrate and penetrating through the substrate, to provide power and ground signals to the transistors; a dielectric material, laterally surrounding the first semiconductor die; and a second semiconductor die, having a central portion bonded with the first semiconductor die and a peripheral portion in contact with the dielectric material.