US Patent Application 17730813. DEVICE AND METHOD FOR TREATING SUBSTRATE simplified abstract
Contents
DEVICE AND METHOD FOR TREATING SUBSTRATE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shao-Yong Chen of Hsinchu (TW)
DEVICE AND METHOD FOR TREATING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17730813 titled 'DEVICE AND METHOD FOR TREATING SUBSTRATE
Simplified Explanation
The patent application describes a device that includes a substrate retainer and a ring assembly.
- The substrate retainer is used to hold a substrate in place.
- The ring assembly consists of an upper ring with multiple segments that can be adjusted.
- Each segment of the upper ring can move inward or outward to change the gap between the substrate and the inner edge of the segment.
- This adjustment helps in achieving precise positioning of the substrate on the substrate retainer.
Original Abstract Submitted
A device includes a substrate retainer for retaining a substrate thereon, and a ring assembly including an upper ring which has a plurality of upper ring segments that are angularly displaced from each other. Each of the upper ring segments is movable between an inner position and an outer position so as to adjust a gap between an outer periphery of the substrate and an inner edge of each of the upper ring segments when the substrate is retained on the substrate retainer.
