US Patent Application 17664689. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract
Contents
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chin-Hua Wang of New Taipei (TW)
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17664689 titled 'INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Simplified Explanation
The patent application describes a package that includes a package substrate, a package component, and warpage control structures.
- The package substrate has a first side and a second side.
- The package component is bonded to the first side of the package substrate.
- A front-side warpage control structure is attached to the first side of the package substrate.
- A backside warpage control structure is embedded in the package substrate from the second side.
- The front-side warpage control structure includes two disconnected structures separated by a gap.
- The backside warpage control structure includes two disconnected structures separated from each other.
Original Abstract Submitted
A package includes a package substrate, the package substrate having a first side and a second side opposite to the first side, a package component bonded to the first side of the package substrate, a front-side warpage control structure attached to the first side of the package substrate, and a backside warpage control structure embedded in the package substrate from the second side of the package substrate. The front-side warpage control structure includes a first disconnected structure and a second disconnected structure laterally separated from each other by a gap. The backside warpage control structure includes a third disconnected structure and a fourth disconnected structure laterally separated from each other.
