US Patent Application 17664538. SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING simplified abstract

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Meng-Liang Lin of Hsinchu (TW)

Li-Ling Liao of Hsinchu City (TW)

Shin-Puu Jeng of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17664538 titled 'SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

Simplified Explanation

- The patent application describes a semiconductor package for high-performance computing. - The package includes an interposer, which is a component that connects the semiconductor chip to the rest of the system. - The interposer has tapered interconnect structures that are formed using a laser plug process. - These tapered interconnect structures are shorter than the column-shaped interconnect structures formed using a through-silicon via process. - The shorter length reduces the thickness of the interposer and the length of electrical connections through it. - This improves signal integrity and reduces parasitics, leading to better performance of the semiconductor package. - The reduced thickness of the interposer also saves space in the computing system.

Original Abstract Submitted

Some implementations herein describe a semiconductor package. The semiconductor package, which may correspond to a high-performance computing semiconductor package, includes an interposer. The interposer includes tapered interconnect structures formed using a laser plug process. The tapered interconnect structures may include a length that is lesser relative to a length of the column-shaped interconnect structures formed using a through-silicon via process. Such a length reduces a thickness of the interposer and reduces a length of electrical connections through the interposer. In this way, a signal integrity may be increased and parasitics of the semiconductor package including the tapered interconnect structures may be reduced to increase a performance of the semiconductor package. Additionally, the reduced thickness of the interposer may reduce an overall thickness of the semiconductor package to save space consumed by the semiconductor package in a computing system.