US Patent Application 17660789. CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM simplified abstract
Contents
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
Organization Name
Microsoft Technology Licensing, LLC
Inventor(s)
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17660789 Titled 'CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM'
Simplified Explanation
The abstract describes a type of film that can be used to shield electronic components from electromagnetic interference (EMI). The film consists of two layers - a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is designed to coat over electronic components on a substrate when heat is applied. The electrically conductive film layer is located on the opposite side of the thermal-forming film layer and contains voids that can deform when heat is applied. This allows the electrically conductive film layer to conform to the shape of the thermal-forming film layer, providing effective EMI shielding.
Original Abstract Submitted
Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.
