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18484372. SELECTIVE PASSIVATION OF PHOTORESISTS (Tokyo Electron Limited)
[[Category:H01L21/027]] [[Category:H01L21/308]] ...

1 KB (183 words) - 05:18, 11 April 2025
International business machines corporation (20250089347). CIRCULAR-SHAPED RESISTOR
[[Category:H01L21/02]] [[Category:H01L21/311]] ...

1 KB (173 words) - 03:06, 15 March 2025
18465376. CIRCULAR-SHAPED RESISTOR (International Business Machines Corporation)
[[Category:H01L21/02]] [[Category:H01L21/311]] ...

1 KB (173 words) - 04:09, 15 March 2025
Taiwan semiconductor manufacturing co., ltd. (20250087496). METHODS FOR FABRICATING SEMICONDCUTOR STRUCTURES
[[Category:H01L21/311]] [[Category:H01L21/033]] ...

1 KB (140 words) - 02:45, 15 March 2025
18959832. METHODS FOR FABRICATING SEMICONDCUTOR STRUCTURES (Taiwan Semiconductor Manufacturing Co., Ltd.)
[[Category:H01L21/311]] [[Category:H01L21/033]] ...

1 KB (140 words) - 04:05, 15 March 2025
US Patent Application 18351149. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
[[Category:H01L21/265]] [[Category:H01L21/04]] ...

3 KB (387 words) - 02:37, 4 December 2023
Sk hynix inc. (20250006801). METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
[[Category:H01L21/311]] [[Category:H01L21/3213]] ...

1 KB (165 words) - 04:29, 25 March 2025
Intel corporation (20250022939). CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L21/033]] ...

3 KB (392 words) - 02:31, 26 March 2025
Kabushiki kaisha toshiba (20250095999). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
[[Category:H01L21/304]] [[Category:H01L21/02]] ...

1 KB (221 words) - 03:36, 24 March 2025
18419281. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE (KABUSHIKI KAISHA TOSHIBA)
[[Category:H01L21/304]] [[Category:H01L21/02]] ...

1 KB (221 words) - 04:53, 24 March 2025
Taiwan semiconductor manufacturing company, ltd. (20250069893). SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
[[Category:H01L21/311]] [[Category:H01L21/02]] ...

2 KB (255 words) - 07:45, 17 March 2025
18938789. SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (Taiwan Semiconductor Manufacturing Company, LTD.)
[[Category:H01L21/311]] [[Category:H01L21/02]] ...

2 KB (255 words) - 09:27, 17 March 2025
US Patent Application 18231912. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME simplified abstract
[[Category:H01L21/033]] [[Category:H01L21/311]] ...

2 KB (303 words) - 10:11, 4 December 2023
US Patent Application 18359747. REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES simplified abstract
[[Category:H01L21/8238]] [[Category:H01L21/8234]] ...

3 KB (380 words) - 10:10, 1 December 2023
Intel corporation (20250098258). PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L21/033]] ...

3 KB (379 words) - 02:26, 24 March 2025
18970265. PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
[[Category:H01L21/02]] [[Category:H01L21/033]] ...

3 KB (379 words) - 05:03, 24 March 2025
18419281. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
[[Category:H01L21/304]] [[Category:H01L21/02]] ...

2 KB (227 words) - 05:10, 24 March 2025
Intel corporation (20250072078). HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L21/033]] ...

3 KB (392 words) - 06:53, 17 March 2025
18940382. HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
[[Category:H01L21/02]] [[Category:H01L21/033]] ...

3 KB (392 words) - 09:41, 17 March 2025
Taiwan semiconductor manufacturing co., ltd. (20250105054). SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP
[[Category:H01L21/764]] [[Category:H01L21/265]] ...

2 KB (252 words) - 03:48, 30 March 2025

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