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• US Patent Application 18032168. DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL simplified abstract
  [[Category:C22C26/00]] [[Category:B22F5/00]]
  2 KB (325 words) - 09:04, 6 December 2023
• 18396981. Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding Material simplified abstract (SEIKO EPSON CORPORATION)
  [[Category:C22C26/00]]
  4 KB (503 words) - 05:19, 8 July 2024
• Patent Applications Report for 7th Feb 2025
  ...(1), [[:Category:G06F40/295|G06F40/295]] (1), [[:Category:G06N20/00|G06N20/00]] (1) ...] (2), [[:Category:G06T17/00|G06T17/00]] (2), [[:Category:G06N20/00|G06N20/00]] (2), [[:Category:A63F13/355|A63F13/355]] (1)
  86 KB (10,753 words) - 16:35, 19 February 2025