Plasma Technology Patent Application Trends 2024

Plasma Technology patent applications in 2024

Top Technology Areas in Plasma Technology

Top CPC Codes

• H01J2237/334 (No explanation available)
  • Count: 49 patents
  • Example: 20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01J37/32715 (No explanation available)
  • Count: 45 patents
  • Example: 20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD simplified abstract (Tokyo Electron Limited)
• H01J37/32449 (No explanation available)
  • Count: 31 patents
  • Example: 20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01J37/32183 (No explanation available)
  • Count: 27 patents
  • Example: 20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01J37/32568 (No explanation available)
  • Count: 25 patents
  • Example: 20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE simplified abstract (Lam Research Corporation)
• H01J37/32091 (No explanation available)
  • Count: 24 patents
  • Example: 20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS simplified abstract (Applied Materials, Inc.)
• H01J37/32174 (No explanation available)
  • Count: 22 patents
  • Example: 20240105424. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
• H01J37/3244 (No explanation available)
  • Count: 20 patents
  • Example: 20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
• H01J37/32724 (No explanation available)
  • Count: 20 patents
  • Example: 20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01J37/32146 (No explanation available)
  • Count: 20 patents
  • Example: 20240105424. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)

Top Companies in Plasma Technology

Tokyo Electron Limited

• Number of Plasma Technology patents: 110
• Top CPC codes:
  • H01J37/32715 (No explanation available): 30 patents
  • H01J2237/334 (No explanation available): 28 patents
  • H01J37/32449 (No explanation available): 20 patents
• Recent patents:
  • 20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK simplified abstract (Tokyo Electron Limited) (20240208)
  • 20240047184. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited) (20240208)
  • 20240049379. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited) (20240208)

Applied Materials, Inc.

• Number of Plasma Technology patents: 22
• Top CPC codes:
  • H01J37/32128 (No explanation available): 9 patents
  • H01J37/32183 (No explanation available): 8 patents
  • H01J37/32146 (No explanation available): 7 patents
• Recent patents:
  • 20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING simplified abstract (Applied Materials, Inc.) (20240509)
  • 20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER simplified abstract (Applied Materials, Inc.) (20240125)
  • 20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.) (20240208)

Hitachi High-Tech Corporation

• Number of Plasma Technology patents: 11
• Top CPC codes:
  • H01J37/32174 (No explanation available): 3 patents
  • H01J37/32715 (No explanation available): 3 patents
  • H01L21/67069 (No explanation available): 3 patents
• Recent patents:
  • 20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation) (20240208)
  • 20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation) (20240208)
  • 20240047258. PLASMA PROCESSING APPARATUS simplified abstract (Hitachi High-Tech Corporation) (20240208)

TOKYO ELECTRON LIMITED

• Number of Plasma Technology patents: 9
• Top CPC codes:
  • H01J2237/334 (No explanation available): 3 patents
  • H01J37/32247 (No explanation available): 3 patents
  • H01J37/3222 (No explanation available): 2 patents
• Recent patents:
  • 20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED) (20240523)
  • 20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED) (20240125)
  • 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED) (20240125)

Lam Research Corporation

• Number of Plasma Technology patents: 8
• Top CPC codes:
  • H01J37/32642 (No explanation available): 2 patents
  • H01J37/32568 (No explanation available): 2 patents
  • H01L21/67069 (No explanation available): 2 patents
• Recent patents:
  • 20240055285. CONTROL OF WAFER BOW IN MULTIPLE STATIONS simplified abstract (Lam Research Corporation) (20240215)
  • 20240167161. SPATIALLY TUNABLE DEPOSITION TO COMPENSATE WITHIN WAFER DIFFERENTIAL BOW simplified abstract (Lam Research Corporation) (20240523)
  • 20240218509. MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA simplified abstract (Lam Research Corporation) (20240704)

HITACHI HIGH-TECH CORPORATION

• Number of Plasma Technology patents: 8
• Top CPC codes:
  • H01J2237/334 (No explanation available): 5 patents
  • H01L21/67069 (No explanation available): 3 patents
  • H01J37/32972 (No explanation available): 2 patents
• Recent patents:
  • 20240194453. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION) (20240613)
  • 20240194461. PLASMA PROCESSING METHOD simplified abstract (HITACHI HIGH-TECH CORPORATION) (20240613)
  • 20240222096. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION) (20240704)

SAMSUNG ELECTRONICS CO., LTD.

• Number of Plasma Technology patents: 6
• Top CPC codes:
  • H01J37/3244 (No explanation available): 3 patents
  • H01J37/3211 (No explanation available): 2 patents
  • H01J37/32642 (No explanation available): 2 patents
• Recent patents:
  • 20240212992. PLASMA PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (20240627)
  • 20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (20240321)
  • 20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (20240201)

Advanced Energy Industries, Inc.

• Number of Plasma Technology patents: 6
• Top CPC codes:
  • H01J37/32935 (No explanation available): 2 patents
  • H01L21/67069 (No explanation available): 2 patents
  • G05B13/0275 (No explanation available): 1 patents
• Recent patents:
  • 20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS simplified abstract (Advanced Energy Industries, Inc.) (20240229)
  • 20240194452. BIAS SUPPLY WITH RESONANT SWITCHING simplified abstract (Advanced Energy Industries, Inc.) (20240613)
  • 20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH simplified abstract (Advanced Energy Industries, Inc.) (20240125)

Panasonic Intellectual Property Management Co., Ltd.

• Number of Plasma Technology patents: 4
• Top CPC codes:
  • H01J37/32183 (No explanation available): 2 patents
  • H01J2237/334 (No explanation available): 2 patents
  • H01J37/321 (No explanation available): 1 patents
• Recent patents:
  • 20240014009. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.) (20240111)
  • 20240038511. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.) (20240201)
  • 20240112892. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.) (20240404)

Samsung Electronics Co., Ltd.

• Number of Plasma Technology patents: 3
• Top CPC codes:
  • H02M7/539 (No explanation available): 1 patents
  • H01J37/241 (No explanation available): 1 patents
  • H02M1/088 (No explanation available): 1 patents
• Recent patents:
  • 20240128892. POWER GENERATOR WITH PARTIAL SINUSOIDAL WAVEFORM, PLASMA PROCESSING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (20240418)
  • 20240162014. PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.) (20240516)
  • 20240038505. PLASMA PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.) (20240201)

New Companies in Plasma Technology (Last Month)

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No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

• H05H1/4652 (No explanation available)
  • Count: 1 patents
  • Example: 20240049379. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01L21/67063 (No explanation available)
  • Count: 1 patents
  • Example: 20240047258. PLASMA PROCESSING APPARATUS simplified abstract (Hitachi High-Tech Corporation)
• H01L21/67109 (No explanation available)
  • Count: 1 patents
  • Example: 20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)
• H01L21/67115 (No explanation available)
  • Count: 1 patents
  • Example: 20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation)
• H01J2237/24578 (No explanation available)
  • Count: 1 patents
  • Example: 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED)
• G05B15/02 (No explanation available)
  • Count: 1 patents
  • Example: 20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED)
• G01N25/72 (No explanation available)
  • Count: 1 patents
  • Example: 20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• G01M3/002 (No explanation available)
  • Count: 1 patents
  • Example: 20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H01J2237/3342 (No explanation available)
  • Count: 1 patents
  • Example: 20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
• H05B6/62 (No explanation available)
  • Count: 1 patents
  • Example: 20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD simplified abstract (Tokyo Electron Limited)

Top Companies in Emerging Plasma Technology Technologies

• Tokyo Electron Limited: 5 patents
• TOKYO ELECTRON LIMITED: 2 patents
• Hitachi High-Tech Corporation: 2 patents
• Applied Materials, Inc.: 1 patents