Kuprion Inc. Patent Application Trends in 2024
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Contents
Kuprion Inc. Patent Filing Activity
Kuprion Inc. patent applications in 2024
Top 10 Technology Areas
- A01N59/20 (PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF (preservation of food or foodstuff)
- A01N25/34 (Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group)
- A01P1/00 (Disinfectants; Antimicrobial compounds or mixtures thereof)
- A61L31/022 (METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES (preservation of bodies or disinfecting characterised by the agents employed)
- A61L31/088 (METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES (preservation of bodies or disinfecting characterised by the agents employed)
- A61L31/16 (METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES (preservation of bodies or disinfecting characterised by the agents employed)
- C09D5/14 (COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics)
- C09D7/61 (COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics)
- C09D7/67 (COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics)
- C09D163/00 (Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins)
Emerging Technology Areas
- H05K2201/066 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K2201/0257 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/097 (Use of materials for the {conductive, e.g. } metallic pattern)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/0204 ({using means for thermal conduction connection in the thickness direction of the substrate ()
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K3/4053 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/112 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/09 (Use of materials for the {conductive, e.g. } metallic pattern)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- H05K1/0206 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240206048. Thermal Management in Circuit Board Assemblies simplified abstract (Kuprion Inc.)
- C08K2201/011 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives)
Top Inventors
- Zinn A. Alfred of Palo Alto CA (US) (1 patent)
- Brody Rachel of Mountain View CA (US) (1 patent)
- Alfred A. Zinn of Palo Alto CA (US) (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Kuprion Inc.
- Companies
- CPC A01N59/20
- CPC A01N25/34
- CPC A01P1/00
- CPC A61L31/022
- CPC A61L31/088
- CPC A61L31/16
- CPC C09D5/14
- CPC C09D7/61
- CPC C09D7/67
- CPC C09D163/00
- CPC A61L2300/404
- CPC C08K2003/085
- CPC C08K2201/011
- CPC H05K1/0206
- CPC H05K1/09
- CPC H05K1/112
- CPC H05K1/115
- CPC H05K3/4053
- CPC H05K1/0204
- CPC H05K1/097
- CPC H05K2201/0257
- CPC H05K2201/066
- Patent Trends by Company in 2024
