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Category:Jaesic Lee of Suwon-si (KR)

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Jaesic Lee

Jaesic Lee from Suwon-si (KR) has applied for patents in technology areas such as H01L25/10, H01L23/00, H01L23/31 with samsung electronics co., ltd..

Patents

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER (20250087646)

Pages in category "Jaesic Lee of Suwon-si (KR)"

The following 3 pages are in this category, out of 3 total.

1

18437638. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
18606888. SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER (Samsung Electronics Co., Ltd.)

S

Samsung electronics co., ltd. (20250087646). SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

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