Samsung electronics co., ltd. (20250087646). SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

Organization Name

samsung electronics co., ltd.

Inventor(s)

Hyunsoo Chung of Suwon-si (KR)

Kwang-Soo Kim of Suwon-si (KR)

Jaesic Lee of Suwon-si (KR)

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

This abstract first appeared for US patent application 20250087646 titled 'SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

Original Abstract Submitted

a semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a first mold layer at least partially covering the first redistribution substrate and the first semiconductor chip, a plurality of first conductive pillars at least partially penetrating the first mold layer and contacting the first redistribution substrate, a second redistribution substrate on the first mold layer, a second semiconductor chip on the second redistribution substrate, a second mold layer at least partially covering the second redistribution substrate and the second semiconductor chip, a plurality of second conductive pillars at least partially penetrating the second mold layer and contacting the second redistribution substrate, and a third redistribution substrate on the second mold layer. the first semiconductor chip includes a first through via. the second semiconductor chip includes a backside power delivery network layer.