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Category:G02B6/30
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Pages in category "G02B6/30"
The following 17 pages are in this category, out of 17 total.
1
- 17461534. EDGE COUPLERS AND METHODS OF MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18059074. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18232319. EDGE COUPLERS AND METHODS OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18336473. PHOTONICS GRATING COUPLER AND METHOD OF MANUFACTURE simplified abstract (Micron Technology, Inc.)
- 18401811. PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18488074. METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY simplified abstract (Intel Corporation)
I
- Intel corporation (20240111098). METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY simplified abstract
- Intel corporation (20240176085). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on May 30th, 2024
T
U
- US Patent Application 18362121. SOURCE/DRAIN FEATURE SEPARATION STRUCTURE simplified abstract
- US Patent Application 18448032. FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME simplified abstract
- US Patent Application 18448046. METHOD OF MAKING PHOTONIC DEVICE simplified abstract
- US Patent Application 18448095. METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING simplified abstract
- US Patent Application 18448429. BROADBAND OPTICAL COUPLING USING DISPERSIVE ELEMENTS simplified abstract