Category:Chunnan FENG

Chunnan FENG

Executive Summary

Chunnan FENG is an inventor who has filed 5 patents. Their primary areas of innovation include formed by a conductive layer on an insulating support {(patch antennas (3 patents), {in a stacked or folded configuration} (1 patents), Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith} ( (1 patents), and they have worked with companies such as Beijing BOE Sensor Technology Co., Ltd. (5 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01Q1/38 (formed by a conductive layer on an insulating support {(patch antennas): 3 patents
• H01Q9/0414 ({in a stacked or folded configuration}): 1 patents
• H01Q1/36 (Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith} (): 1 patents
• H01Q21/08 (the units being spaced along or adjacent to a rectilinear path {(waveguide fed): 1 patents
• H01Q9/045 ({with particular feeding means (for circular polarisation): 1 patents
• H04B1/38 (Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving): 1 patents
• H01Q1/48 (Earthing means; Earth screens; Counterpoises): 1 patents
• H01Q1/50 (Structural association of antennas with earthing switches, lead-in devices or lightning protectors): 1 patents
• H01Q21/064 ({using horn or slot aerials (slotted waveguides arrays): 1 patents
• G02F1/136295 (based on liquid crystals, e.g. single liquid crystal display cells): 1 patents
• H04W4/80 (WIRELESS COMMUNICATION NETWORKS (broadcast communication): 1 patents
• H05K1/189 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• G02F1/136209 (based on liquid crystals, e.g. single liquid crystal display cells): 1 patents
• H05K2201/10136 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01Q1/22 (by structural association with other equipment or articles): 1 patents
• H10K59/131 (ORGANIC ELECTRIC SOLID-STATE DEVICES): 1 patents
• H10K59/90 (ORGANIC ELECTRIC SOLID-STATE DEVICES): 1 patents

Companies

List of Companies

• Beijing BOE Sensor Technology Co., Ltd.: 5 patents

Collaborators

• Zhifeng ZHANG (4 collaborations)
• Yong LI (3 collaborations)
• Haoyang ZHANG (3 collaborations)
• Chuncheng CHE (3 collaborations)
• Feng QU (2 collaborations)
• Yunnan JIN (2 collaborations)
• Jingjun DU (1 collaborations)
• Jiaqiang WANG (1 collaborations)
• Xiaojuan WU (1 collaborations)
• Yu ZHAO (1 collaborations)
• Zizheng XIE (1 collaborations)
• Yeyu FENG (1 collaborations)
• Wei WANG (1 collaborations)
• Bin LIU (1 collaborations)
• Shuo LI (1 collaborations)
• Changbo LIU (1 collaborations)