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Category:CPC H01L21/76802
Pages in category "CPC H01L21/76802"
The following 62 pages are in this category, out of 62 total.
1
- 18480225. INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587825. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18673578. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18679546. USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18743574. Air-Replaced Spacer for Self-Aligned Contact Scheme simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
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- Nanya technology corporation (20240347378). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARIZATION AND SEMICONDUCTOR STRUCTURE THEREOF simplified abstract
- Nanya technology corporation (20240347379). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARIZATION AND SEMICONDUCTOR STRUCTURE THEREOF simplified abstract
- NANYA TECHNOLOGY CORPORATION patent applications on October 17th, 2024
- NXP USA, INC. Patent Application Trends in 2025
- NXP USA, Inc. Patent Application Trends in 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SK hynix Inc. Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240312833). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250112087). INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 3rd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240243008). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321629). USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339355). Air-Replaced Spacer for Self-Aligned Contact Scheme simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- The Regents of The University Of California Patent Application Trends in 2024
- THE REGENTS OF THE UNIVERSITY OF CALIFORNIA Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025