Anhui University Patent Application Trends in 2024
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Contents
Anhui University Patent Filing Activity
Anhui University patent applications in 2024
Top 10 Technology Areas
- H01Q1/48 (Earthing means; Earth screens; Counterpoises)
- B02C4/36 (CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN ({household tools and machines for pulverising foodstuffs, e.g. coffee and spice mills)
- B02C4/04 (CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN ({household tools and machines for pulverising foodstuffs, e.g. coffee and spice mills)
- B02C4/42 (CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN ({household tools and machines for pulverising foodstuffs, e.g. coffee and spice mills)
- C10L1/326 ({Coal-water suspensions})
- C02F1/722 ({Oxidation by peroxides})
- C02F1/30 (by irradiation)
- C02F1/32 (with ultraviolet light)
- C02F1/42 (by ion-exchange (ion-exchange in general)
- C02F1/48 (with magnetic or electric fields ()
Emerging Technology Areas
- H01Q1/273 ({Adaptation for carrying or wearing by persons or animals})
- H01Q9/045 ({with particular feeding means (for circular polarisation)
- B32B2311/12 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B2310/028 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B2309/62 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B2255/205 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B38/162 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B37/10 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B37/06 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
- B32B33/00 (Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class)
- Count: 1 patents
- Example: 20240222314. BONDING METHOD FOR COPPER-COPPER METAL simplified abstract (ANHUI UNIVERSITY)
Top Inventors
- Zhixiang HUANG (5 patents)
- Xingang REN (3 patents)
- Kaikun NIU (3 patents)
- Yingsong LI (3 patents)
- Lixia YANG (3 patents)
- Changji WANG (2 patents)
- Hanxu LI (2 patents)
- Yuanyuan ZHU (2 patents)
- Lei Ding (2 patents)
- Yan Li (2 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- Anhui University
- Companies
- CPC B02C4/36
- CPC B02C4/04
- CPC B02C4/42
- CPC C10L1/326
- CPC C02F1/722
- CPC C02F1/30
- CPC C02F1/32
- CPC C02F1/42
- CPC C02F1/48
- CPC C02F2001/422
- CPC C02F2101/34
- CPC C02F2103/06
- CPC C02F2303/04
- CPC C02F2305/023
- CPC C09K5/045
- CPC C09K2205/106
- CPC C09K2205/122
- CPC C09K2205/32
- CPC G01N25/32
- CPC G01N33/24
- CPC H01P7/00
- CPC H05K1/0236
- CPC E02B8/085
- CPC H04B17/3912
- CPC H04B17/19
- CPC C01B3/0078
- CPC E21B43/295
- CPC E21F11/00
- CPC G01N21/1702
- CPC G01N1/14
- CPC G01N33/0027
- CPC G01N2021/1704
- CPC G01N2201/06113
- CPC G01N2201/0636
- CPC B01J20/24
- CPC B01J20/20
- CPC B01J20/28047
- CPC B01J20/3071
- CPC B01J20/3204
- CPC B01J20/3242
- CPC C02F1/288
- CPC C02F2101/20
- CPC H01L29/7824
- CPC H01L23/3738
- CPC H01L29/0607
- CPC H01M4/8807
- CPC H01M4/8605
- CPC H01M4/8846
- CPC H01M4/886
- CPC H01M4/96
- CPC H01Q9/0435
- CPC H01Q1/48
- CPC H01Q9/065
- CPC H01Q15/14
- CPC C09D5/1656
- CPC C09D5/1693
- CPC C09D7/62
- CPC C09D7/67
- CPC C09D191/08
- CPC C25D11/34
- CPC E21B47/06
- CPC E21B33/13
- CPC H01J37/32449
- CPC C23C16/0227
- CPC C23C16/0254
- CPC C23C16/26
- CPC C23C16/50
- CPC C23C8/38
- CPC H01J2237/332
- CPC C10J3/723
- CPC G05D23/12
- CPC C10J3/76
- CPC C10J2200/09
- CPC C10J2300/1838
- CPC C10J2300/1253
- CPC C10J2300/093
- CPC A61K47/22
- CPC A61K31/337
- CPC A61K31/415
- CPC A61K31/4184
- CPC A61K31/445
- CPC A61K38/28
- CPC A61K38/38
- CPC A61K47/34
- CPC C07D317/34
- CPC B32B15/01
- CPC B32B33/00
- CPC B32B37/06
- CPC B32B37/10
- CPC B32B38/162
- CPC B32B2255/205
- CPC B32B2309/62
- CPC B32B2310/028
- CPC B32B2311/12
- CPC H01Q9/045
- CPC H01Q1/273
- Patent Trends by Company in 2024
