US Patent Application 18365517. DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL simplified abstract
Contents
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ya-Wen Chiu of Tainan City (TW)
Cheng-Po Chau of Tainan City (TW)
Chih Ping Liao of Hsinchu (TW)
Sen-Hong Syue of Zhubei City (TW)
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18365517 titled 'DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
Simplified Explanation
- The patent application describes methods and devices for performing a high pressure anneal process during the formation of a semiconductor device. - The high pressure anneal process can be either a dry process with process gases or a wet process with steam. - The purpose of the high pressure anneal process is to enhance the formation of the semiconductor device. - The invention provides embodiments of devices that can create and maintain the required pressurized environment for the anneal process. - The patent application emphasizes the importance of the high pressure anneal process in improving the performance and reliability of semiconductor devices.
Original Abstract Submitted
Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen of Hsinchu (TW)
- Ya-Wen Chiu of Tainan City (TW)
- Cheng-Po Chau of Tainan City (TW)
- Yi Che Chan of Hsinchu (TW)
- Chih Ping Liao of Hsinchu (TW)
- YungHao Wang of Hsinchu (TW)
- Sen-Hong Syue of Zhubei City (TW)
- H01L21/02
- H01L29/66
- H01L21/8234
- H01L21/768
- H01L21/762