US Patent Application 18245404. Semiconductor Integrated Circuit simplified abstract
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Contents
Semiconductor Integrated Circuit
Organization Name
Nippon Telegraph and Telephone Corporation
Inventor(s)
Miwa Muto of Musashino-shi, Tokyo (JP)
Hideaki Matsuzaki of Musashino-shi, Tokyo (JP)
Semiconductor Integrated Circuit - A simplified explanation of the abstract
This abstract first appeared for US patent application 18245404 titled 'Semiconductor Integrated Circuit
Simplified Explanation
The patent application describes a method of applying a second protective film on top of a first protective film.
- The second protective film is formed to cover the first protective film.
- The end portion of the second protective film is positioned between a wiring line and a bonding pad at the edge of the bonding pad.
- The purpose of the second protective film is to provide additional protection to the first protective film and the components underneath.
- This method helps to prevent damage or contamination to the wiring line and bonding pad.
- The invention improves the overall durability and reliability of the protected components.
Original Abstract Submitted
A second protective film is formed on and in contact with a first protective film, and is formed to cover the first protective film. The second protective film is also formed so that an end portion extending toward the center of a first opening is interposed between a wiring line and a bonding pad at the edge portion of the bonding pad.