US Patent Application 18230999. SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Cheng-Chieh Hsieh of Tainan (TW)]]
[[Category:Hau Tao of Hsinchu City (TW)]]
[[Category:Yung-Tien Kuo of Hsinchu City (TW)]]
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18230999 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
Simplified Explanation
The patent application describes a semiconductor device that includes an interposer placed on a substrate.
- The interposer has two major surfaces, with the first one facing the substrate and the second one facing opposite to the first.
- A system on a chip is placed on the second major surface of the interposer.
- The first major surface of the interposer contains a plurality of first passive devices.
- The second major surface of the interposer contains a plurality of second passive devices.
- The second passive devices are different from the first passive devices.
Original Abstract Submitted
A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.