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Category:H01L21/308
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Pages in category "H01L21/308"
The following 200 pages are in this category, out of 229 total.
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- 17532423. PROCESSOR DIE ALIGNMENT GUIDES simplified abstract (International Business Machines Corporation)
- 17548913. NANOSHEET DEVICE WITH VERTICAL BLOCKER FIN simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17590863. METHODS OF FORMING FIN-ON-NANOSHEET TRANSISTOR STACKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17655321. Integration of Multiple Transistors Having Fin and Mesa Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836452. SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17897350. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
- 18059093. SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18090434. DENSIFICATION AND REDUCTION OF SELECTIVELY DEPOSITED Si PROTECTIVE LAYER FOR MASK SELECTIVITY IMPROVEMENT IN HAR ETCHING simplified abstract (Tokyo Electron Limited)
- 18094839. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18110778. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18123095. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18143076. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (United Microelectronics Corp.)
- 18156123. Reduction of Line Wiggling simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18157395. STRUCTURE OF ISOLATION FEATURE OF SEMICONDUCTOR DEVICE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18167741. SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171528. NONLINEAR CHANNEL simplified abstract (International Business Machines Corporation)
- 18171765. SEMICONDUCTOR STRUCTURE WITH DEVICE INCLUDING AT LEAST ONE IN-WELL POROUS REGION simplified abstract (GlobalFoundries U.S. Inc.)
- 18190917. PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18243185. METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18281993. NAPHTHALENE UNIT-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18285141. COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18318854. SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract (Samsung Electronics Co., Ltd.)
- 18355520. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18356322. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18359241. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18367292. GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18402563. METHOD OF BREAKING THROUGH ETCH STOP LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18416508. TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18418757. SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18419879. HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18427044. PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18434121. Semiconductor Patterning and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435294. MULTIPLE-STACK THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18435609. DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18436812. SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18477290. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491470. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FINS USING ETCHING MASKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18500254. SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract (Micron Technology, Inc.)
- 18500662. PATTERN FORMING METHOD, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18501124. ELEMENT CHIP MANUFACTURING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18511016. THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511711. EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGION AND AN EPITAXIAL CAPPING REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525131. METHOD FOR NON-RESIST NANOLITHOGRAPHY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525473. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18531359. ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract (Intel Corporation)
- 18543934. Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18560422. IN SITU DAMAGE FREE ETCHING OF Ga2O3 USING Ga FLUX FOR FABRICATING HIGH ASPECT RATIO 3D STRUCTURES simplified abstract (Ohio State Innovation Foundation)
- 18581182. SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18591923. GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18593504. FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract (Micron Technology, Inc.)
- 18594816. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18599374. FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC CIRCUIT simplified abstract (Huawei Technologies Co., Ltd.)
- 18601541. Method For Forming Resist Underlayer Film And Patterning Process simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18604167. WET ANISOTROPIC ETCHING OF SILICON simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18608191. Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same simplified abstract (Lodestar Licensing Group LLC)
- 18608294. SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD OF FORMING SEMICONDUCTOR BODIES OF VARYING WIDTH simplified abstract (Intel Corporation)
- 18608940. HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATING METHOD OF THE SAME simplified abstract (UNITED MICROELECTRONICS CORP.)
- 18624386. Isolation Structures Of Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18625348. GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18634408. CLEANING SOLUTION AND METHOD OF CLEANING WAFER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639575. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18649086. PHOTORESIST LAYER OUTGASSING PREVENTION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662772. SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667981. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18676056. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)
- 18731392. HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME simplified abstract (United Microelectronics Corp.)
- 18735002. SEMICONDUCTOR STORAGE DEVICE COMPRISING STAIRCASE PORTION simplified abstract (Kioxia Corporation)
- 18747951. SUBSTRATE PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18749534. METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18815864. HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME (UNITED MICROELECTRONICS CORP.)
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- Innolux corporation (20240295823). METHOD FOR MANUFACTURING ELECTRONIC DEVICE simplified abstract
- InnoLux Corporation patent applications on September 5th, 2024
- Intel corporation (20240105520). TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240120206). ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract
- Intel corporation (20240162332). TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240178071). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240186403). DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240222509). SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD OF FORMING SEMICONDUCTOR BODIES OF VARYING WIDTH simplified abstract
- Intel corporation (20240249946). GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel corporation (20240290789). TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE simplified abstract
- Intel corporation (20240332399). GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on August 29th, 2024
- INTEL CORPORATION patent applications on February 8th, 2024
- Intel Corporation patent applications on July 25th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- International business machines corporation (20240178156). SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract
- International business machines corporation (20240282860). NONLINEAR CHANNEL simplified abstract
- International Business Machines Corporation patent applications on August 22nd, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024
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- Micron technology, inc. (20240178272). SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract
- Micron technology, inc. (20240297124). FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract
- Micron technology, inc. (20240315018). Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract
- Micron technology, inc. (20240429104). DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION COMPRISING AN OXIDE SEMICONDUCTOR MATERIAL
- Micron Technology, Inc. patent applications on December 26th, 2024
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on February 8th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
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- Samsung electronics co., ltd. (20240105842). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162225). SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract
- Samsung electronics co., ltd. (20240186321). SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER simplified abstract
- Samsung electronics co., ltd. (20240194488). METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN simplified abstract
- Samsung electronics co., ltd. (20240222123). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240250031). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266170). PATTERN FORMING METHOD, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290626). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240332059). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339334). SUBSTRATE PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240411227). PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
- Samsung electronics co., ltd. (20240429052). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 10th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 10th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240096623). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128126). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVCE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240184195). METHOD OF MANUFACTURING PHASE SHIFT PHOTO MASKS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186142). Photolithography Methods and Resulting Structures simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194537). SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250122). Isolation Structures Of Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250123). GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429051). PHOTORESIST AND FORMATION METHOD THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20240429305). Semiconductor Device Having FIN Structure and Method of Forming Thereof
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105518). METHOD FOR FORMING SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112905). Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120409). METHOD FOR NON-RESIST NANOLITHOGRAPHY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240134279). PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136183). METHOD OF BREAKING THROUGH ETCH STOP LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136222). Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240177995). Semiconductor Patterning and Resulting Structures simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240210822). SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258114). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258168). Self Aligned Contact Scheme simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240260249). Memory Device with Improved Margin and Performance and Methods of Formation Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282571). METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282577). PHOTORESIST LAYER OUTGASSING PREVENTION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282582). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240288776). METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297036). CLEANING SOLUTION AND METHOD OF CLEANING WAFER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297079). SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240302591). METHODS OF FORMING PHOTONIC DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339327). METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347637). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379346). FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379359). Patterning Semiconductor Devices and Structures Resulting Therefrom simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379373). HIGH ASPECT RATIO BOSCH DEEP ETCH simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379445). Methods for Fabricating FinFETs Having Different Fin Numbers and Corresponding FinFETs Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379594). BOND PAD WITH ENHANCED RELIABILITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379675). ACTIVE REGION PATTERNING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379801). TUNING GATE LENGTHS IN MULTI-GATE FIELD EFFECT TRANSISTORS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379852). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413012). Semiconductor Device and Method
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
